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GE HEALTHCARE
D
IRECTION 5194296-100, REVISION 10 LOGIQ BOOK XP SERIES BASIC SERVICE MANUAL
Chapter 4 Functional Checks 4-15
4-3-8-3 M Mode Softmenu Key
Table 4-6 M Mode Softmenu Key
Step Task Expected Result(s)
1
Adjust Rejection
Selects a level below which echoes will not be amplified (an echo must have a certain
minimum amplitude before it will be processed).
2
Adjust Sweep Speed
Changes the speed at which the time line is swept. The following speed values are
available, 1, 2, 3, 4, 6, 8, 12, 16.
3
Adjust Edge Enhance
Edge Enhance brings out subtle tissue differences and boundaries by enhancing the
gray scale differences corresponding to the edges of structures. Adjustments to M
Mode's edge enhancement affects the M Mode only.
4
Activate Gray Map Determines how the echo intensity levels received are presented as shades of gray.
6
Activate Colorize Enables gray scale image colorization. To deactivate, reselect a Gray Map.
7
Activate Full Timeline Displays only timeline screen. Press the Full Timescreen to activate.
8
Select Display Format
Select the format to display B image and M image on the LCD. Press Display Format,
and select from the pop up menu.
9
Adjust Dynamic Range
Dynamic Range controls how echo intensities are converted to shades of gray,
thereby increasing the adjustable range of contrast.
10
Power output
Optimizes image quality and allows user to reduce beam intensity. 10% increments
between 0-100%. Values greater than 0.1 are displayed.
- LOGIQ BOOK XP Series 1
- Important Precautions 3
- ΠΡΟΕΙΔΟΠΟΙΗΣΗ 5
- GE HEALTHCARE 10
- WARNINGWARNING 12
- LEGAL NOTES 13
- Revision History 14
- List of Effected Pages(LOEP) 14
- Table of Contents 15
- CHAPTER 2 16
- Pre Installation 16
- CHAPTER 3 17
- Installation 17
- 4 Table of Contents 18
- CHAPTER 4 19
- 6 Table of Contents 20
- CHAPTER 5 21
- CHAPTER 6 22
- CHAPTER 7 23
- 10 Table of Contents 24
- CHAPTER 8 25
- CHAPTER 9 26
- CHAPTER 10 27
- 14 Table of Contents 28
- Chapter 1 29
- Introduction 29
- Section 1-2 31
- Important Conventions 31
- 1-2-2 Standard Hazard Icons 32
- 1-2-3 Product Icons 33
- Table 1-4 Warnings 34
- Chapter 1 Introduction 1-7 35
- Section 1-3 37
- Safety Considerations 37
- 1-3-4 Electrical Safety 38
- 1-3-5 Labels Locations 38
- 1-3-6 Battery Safety 39
- AND ADJUSTING 40
- Section 1-4 43
- EMC, EMI, and ESD 43
- Section 1-5 44
- Customer Assistance 44
- 1-5-2 System Manufacturer 45
- Chapter 2 47
- Section 2-2 48
- General Console Requirements 48
- Inrush Current 49
- 100V 0.38A 0.41A 49
- 240V 0.20A 0.21A 49
- 2-2-3 EMI Limitations 50
- Section 2-3 52
- Facility Needs 52
- 2-3-2 Required Features 53
- 2-3-3 Desirable Features 53
- EXAM INAT IO N 54
- Chapter 3 57
- 3-1-3 Installation Warnings 58
- 3-1-4 Safety Reminders 59
- THE UNIT! 59
- Section 3-2 60
- Interleaver 62
- Plastic bag 62
- Section 3-3 63
- Packing the Equipment 63
- Section 3-4 64
- Preparing for Installation 64
- Section 3-5 65
- Completing the Installation 65
- 3-5-2 Power Off/ Shutdown 66
- 3-5-3 Transducer Connection 67
- Section 3-6 68
- System Configuration 68
- 3-6-3 Approved peripherals 69
- 3-6-4 Connecting Cables 70
- Pin No. Signal Pin No. Signal 72
- Chapter 3 Installation 3-21 77
- Footswitch FSU 2001 78
- Footswitch FSU 1000 78
- 3-6-6 Available Probes 80
- Section 3-7 81
- Software/Option Configuration 81
- Section 3-8 82
- Section 3-9 83
- Loading the System Software 83
- 3-9-4 Functional Check-out 99
- 3-9-5 Option Key Update 100
- EALTHCARE 101
- 3-9-6 Probe Recognition Check 104
- Section 3-10 106
- Paperwork 106
- Chapter 4 107
- Functional Checks 107
- Section 4-3 108
- General Procedure 108
- 4-3-2 Power Off/ Shutdown 109
- 4-3-6 System Features 113
- 4-3-7 B Mode Checks 116
- Step Task Expected Result(s) 117
- 4-3-7-3 B Mode Softmenu Key 118
- 4-3-8 M Mode Controls 119
- 4-3-9 Color Flow Mode Checks 122
- 4-3-10 Doppler Mode Checks 125
- 4-3-11 Basic Measurements 128
- 4-3-12 Probe/Connectors Usage 129
- 4-3-13 Using Cine 130
- 4-3-14 Image Management (QG) 130
- Section 4-4 136
- Software Configuration Checks 136
- Section 4-5 136
- Peripheral Checks 136
- Chapter 5 137
- Section 5-2 138
- Block Diagrams and Theory 138
- 5-2-2 General Information 139
- Section 5-3 140
- Power Diagrams 140
- 5-3-3 Air Flow Distribution 141
- 5-3-4 Fans 142
- Section 5-4 143
- Common Service Platform 143
- 5-4-3 Service Home Page 145
- 5-4-5 Diagnostics 150
- FIELD IS NOT YET POPULATED 151
- FIELD IS NOT YE POPULATED 151
- Chapter 6 155
- Service Adjustments 155
- Section 6-2 156
- Monitor Adjustments 156
- Chapter 7 157
- Diagnostics/Troubleshooting 157
- Section 7-2 158
- Gathering Trouble Data 158
- Section 7-3 160
- Screen Captures 160
- 7-3-3 Capturing a Screen 162
- Section 7-4 164
- 7-4-3 Reset Database 167
- 7-4-3 Reset Database (cont’d) 168
- 7-4-4 Clean Userdefs 169
- 7-4-4 Clean Userdefs (cont’d) 170
- 7-4-5 Update FPGA 171
- 7-4-6 Control Frame 171
- Section 7-5 173
- Common Diagnostics 173
- Section 7-6 175
- 7-6-2 FRU Test 176
- N/A 40001 179
- Chapter 8 181
- Replacement Procedures 181
- Section 8-3 184
- Trackball Roller Cleaning 184
- Chapter 9 187
- Renewal Parts 187
- Section 9-5Keyboard Assy 190
- Section 9-6Bottom Assy 190
- Chapter 9 Renewal Parts 9-9 195
- Chapter 9 Renewal Parts 9-11 197
- Chapter 9 Renewal Parts 9-13 199
- Section 9-10Manuals 201
- Section 9-11Probes 202
- Chapter 10 203
- Care & Maintenance 203
- Section 10-2 204
- Why do Maintenance 204
- Section 10-3 204
- Maintenance Task Schedule 204
- Per Facilities 205
- QA Program Notes 205
- Section 10-4 206
- Tools Required 206
- Section 10-5 207
- System Maintenance 207
- ÷ Step Description 208
- 10-5-3 Input Power 209
- 10-5-4 Cleaning 209
- 10-5-5 Physical Inspection 210
- 10-5-7 Probe Maintenance 211
- Section 10-6 213
- Electrical Safety Tests 213
- Section 10-7 220
- ELECTRICAL SAFETY 222
- 9900 Innovation Drive 226
- Wawautosa, Wisconsin 53226 226
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