Samsung MMCRE28G5MXP-0VB00 Ficha Técnica descarregar pdf (Página 15)

JANUARY 2009

www.samsung.com/semi/ﬂash

MLCNANDFlash

MLC NAND FLASH

Family Density Technology Part Number Package Type Org. Vol(V)

MOQ

RemarksTray T/R

-xxxx0xx -xxx0Txx

16Gb based

4KByte/Page

Cache

128Gb DSP

51nm

K9MDG08U5M-PCB0 TSOP1 x8 3.3 960 1,000

K9MDG08U5M-ZCB0 WELP x8 3.3 960 1,000

64Gb QDP

K9HCG08U1M-PCB0 TSOP1 x8 3.3 960 1,000

K9HCG08U1M-IIB0 ULGA x8 3.3 960 1,000

32Gb DDP

K9LBG08U0M-PCB0 TSOP1 x8 3.3 960 1,000

K9LBG08U1M-IIB0 ULGA x8 3.3 720 2,000 2CE

16Gb mono

K9GAG08U0M-PCB0 TSOP1 x8 3.3 960 1,000

K9GAG08U0M-IIB0 ULGA x8 3.3 720 2,000

8Gb Based

2KByte/Page

W/O Cache

32Gb QDP 59nm K9HBG08U1B-PCB0 TSOP1 x8 3.3 960 1,000

16Gb DDP

51nm K9LAG08U0A-PCB0 TSOP1 x8 3.3 960 1,000

qualify B-die part

# K9LAG08U0B-

PCB0000

59nm K9LAG08U0B-PCB0 TSOP1 x8 3.3 960 1,000

8Gb mono

51nm

K9G8G08U0A-PCB0 TSOP1 x8 3.3 960 1,000

qualify B-die, part

# K9G8G08U0B-

PCB0000

K9G8G08U0A-IIB0 ULGA x8 3.3 960 2,000

59nm K9G8G08U0B-PCB0 TSOP1 x8 3.3 960 1,000

4Gb based 4Gb mono

63nm K9G4G08U0A-PCB0 TSOP1 x8 3.3 960 1,000

qualify B-die, part

# K9G4G08U0B-

PCB0000

51nm K9G4G08U0B-PCB0 TSOP1 x8 3.3 960 1,000

Please contact your local Samsung sales representative for latest product offerings.

Note: All parts are lead free

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