Samsung 1GB, DDR III SDRAM, 1066MHz, CL7 Guia do Utilizador descarregar pdf (Página 9)

December 2008

General Information DDR3 SDRAM

78 Ball FBGA for 1Gb E-die (x4/x8)

96 Ball FBGA for 1Gb E-die (x16)

7.50 ± 0.10

0.80 x 12 = 9.60

0.80 x 8 = 6.40

3.200.80

4.80

78 - ∅0.45 Solder ball

0.2 ABM

(Datum B)

(Datum A)

1.60

MOLDING AREA

#A1 INDEX MARK

11.00 ± 0.10

0.80

(Post Reflow ∅0.05 ± 0.05)

(0.95)

(1.90)

Bottom

Top

Bottom

Top

#A1

7.50 ± 0.10

11.00 ± 0.10

0.10MAX

0.50 ± 0.05

1.10 ± 0.10

0.35 ± 0.05

7.50 ± 0.10

6.00

(Datum B)

(Datum A)

#A1 INDEX MARK

13.30 ± 0.10

0.80 x 15 = 12.00

0.80

0.40

96 - ∅0.45 Solder ball

0.2 ABM

MOLDING AREA

(Post Reflow ∅0.05 ± 0.05)

(0.95)

(1.90)

#A1

7.50 ± 0.10

13.30 ± 0.10

0.10MAX

0.50 ± 0.05

1.10 ± 0.10

0.35 ± 0.05

876543219

0.80 x 8 = 6.40

3.200.80 1.60

876543219

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

DDR3 SDRAM Product Guide 1
M393B5170EH1-CH9 7
December 2008 10

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Samsung 1GB, DDR III SDRAM, 1066MHz, CL7 Guia do Utilizador Página 9

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